Kinex

Hardware

Integrated die-to-wafer hybrid bonding system for HBM, AI accelerators and co-packaged optics, with an AIx-powered software suite providing predictive maintenance, die-level traceability and multi-binning.

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TypeHardware
RoleStandalone tool
AvailabilitySold
DeploymentOn-device
Intended for—
SecurityNot recorded
StatusActive
Sold withinPackaging not stated — the vendor’s page was checked and named no parent or planNot found · 30 Sep 2026
PricingEnterprise quoteNot found · 1 Sep 2026
Sources1 of 1 field

No price published; sitemap for appliedmaterials.com contains no pricing page of any kind.

What it does

appliedmaterials.com

Sources

Pricing

Not found · 1 Sep 2026

Sold within

Not found · 30 Sep 2026

Applied Materials says "Kinex is Applied Materials’ fully integrated hybrid bonding system, purpose-built for HVM environments. Co-developed with BE Semiconductor Industries N.V. (Besi)". Kinex is itself the system; the page states no price, no purchase route and no parent offering; the only route offered is Contact Sales.

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