Kinex
Integrated die-to-wafer hybrid bonding system for HBM, AI accelerators and co-packaged optics, with an AIx-powered software suite providing predictive maintenance, die-level traceability and multi-binning.
No price published; sitemap for appliedmaterials.com contains no pricing page of any kind.
What it does
- Semiconductor manufacturing equipment
- Industrial automation
Sources
- Pricing
- Sold within
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Applied Materials says "Kinex is Applied Materials’ fully integrated hybrid bonding system, purpose-built for HVM environments. Co-developed with BE Semiconductor Industries N.V. (Besi)". Kinex is itself the system; the page states no price, no purchase route and no parent offering; the only route offered is Contact Sales.
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