SE

Samsung HBM4

Hardware

by Samsung Electronics

HBM4 with 2,048 I/O pins, up to 3,300 GB/s bandwidth and 1c DRAM on a 4nm base die, positioned for AI accelerators and datacenter systems.

Find alternatives to Samsung HBM4

B2B component sale; no public pricing on the product page, confirmed by direct fetch.

What it does

• Memory
• AI compute hardware

How it compares

• Micron HBM4

  Both sell high-bandwidth memory into AI accelerators, the segment both product records cover; Micron's 10-K names Samsung first among its memory rivals, though the filing claims the rivalry for memory broadly rather than HBM alone.

  Samsung Electronics Co., Ltd.; SK hynix Inc.; Kioxia Holdings Corporation; Sandisk Corporation; ChangXin Memory Technologies, Inc. (CXMT); and Yangtze Memory Technologies Co., Ltd. (YMTC)

  Regulatory filing · 25 Aug 2026
• HBM4

  NVIDIA (NASDAQ:NVDA) CEO Jensen Huang confirmed on June 5, 2026 that Samsung Electronics (LON:0593xq), SK Hynix Inc (KS:000660), and Micron Technology Inc (NASDAQ:MU) have all passed certification to supply HBM4 high-bandwidth memory for the company's next-generation Vera Rubin AI accelerator platform, marking the first public acknowledgment of approvals for all three major memory manufacturers.

  News reporting · 19 Sep 2026

Sources

Pricing

Not found · 1 Sep 2026

Description

Official documentation · 1 Sep 2026

What it does

Official documentation · 1 Sep 2026

Sold within

Not found · 30 Sep 2026

The page says Samsung "partners with customers to address challenges and help drive the future forward." The page's only route is a footnote: "For further details on product specifications, please contact the sales representative of your region." No price, store, distributor for this part or bundling parent is stated, so how it is bought is not stated.

Name

Official documentation · 1 Sep 2026

URL

Official documentation · 1 Sep 2026

Also from Samsung Electronics

• Bixby Application

  Samsung's voice assistant for hands-free control of Galaxy devices, SmartThings smart-home devices and Quick Commands routines, listed among Galaxy AI's features on Samsung's Galaxy AI page.

• Samsung CMM-D Hardware

  DRAM-based CXL memory expansion module (MD220 and MD310 variants) enabling memory capacity and bandwidth pooling for AI, HPC and in-memory database workloads.

• Samsung Datacenter SSD Hardware

  Enterprise NVMe and SATA SSD line (PM9D3a, PM9A3, PM893a, PM893, PM897a, PM897) that Samsung markets for reducing AI training and inference data-loading time.

• Samsung Foundry HPC/AI Service Infrastructure service

  A foundry service bundling advanced process nodes (5nm to 2nm GAA), 2.5D/3D chiplet packaging, custom-HBM logic-memory integration and co-packaged optics for customers designing AI SoCs and chiplet platforms.

• Galaxy AI Application

  On-device and cloud AI features built into Galaxy phones and tablets, covering translation, writing and photo editing.

• Samsung HBM3 Hardware

  Third-generation High Bandwidth Memory delivering up to 819 GB/s bandwidth and 24GB capacity for AI accelerators and datacenter systems.

• Samsung HBM3E Hardware

  HBM3E in a 12-layer stack offering up to 1,180 GB/s bandwidth and 36GB capacity, in mass production for AI, datacenter and supercomputer applications.

• Samsung GDDR7 Hardware

  Graphics DRAM delivering up to 40 Gbps per pin and up to 24Gb density via PAM3 signaling, for graphics, AI inference acceleration and autonomous-driving sensor fusion workloads.

• Vision AI Companion Application

  On-screen AI assistant built into Samsung Smart TVs that answers questions and assists viewers through the television interface.

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