HBM4
Fifth-generation high-bandwidth memory with 2,048 I/O terminals and over 10Gbps operating speed, roughly doubling HBM3E bandwidth for next-generation AI accelerators.
No public price list; contract supply to accelerator makers. Same sitemap evidence as HBM3E.
What it does
- Memory
- AI compute hardware
- Model training
- Model inference
How it compares
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Micron HBM4
(same competitor list sentence)
Regulatory filing · 18 Sep 2026 -
Samsung HBM4
NVIDIA (NASDAQ:NVDA) CEO Jensen Huang confirmed on June 5, 2026 that Samsung Electronics (LON:0593xq), SK Hynix Inc (KS:000660), and Micron Technology Inc (NASDAQ:MU) have all passed certification to supply HBM4 high-bandwidth memory for the company's next-generation Vera Rubin AI accelerator platform, marking the first public acknowledgment of approvals for all three major memory manufacturers.
News reporting · 19 Sep 2026
Sources
- Pricing
- Sold within
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SK hynix describes HBM4 as "the most advanced AI memory ever developed"; the page states no price and no purchase route beyond "Do you have some questions? Please Contact US."
- URL
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Official documentation · 1 Sep 2026
Catalogue page confirmed live 2026-09-01. Page title "HBM4" matches the record name. Replaces the interim news.skhynix.com launch announcement kept since batch 2.
Also from SK Hynix
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CMM-DDR5 Hardware
CXL 2.0 memory module that expands and pools DDR5 capacity and bandwidth beyond the CPU's own channels for AI and high-performance computing servers, with a 96GB version through customer validation and a 128GB 1bnm version following.
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HBM3E Hardware
Fourth-generation high-bandwidth memory that vertically stacks up to 12 DRAM layers for 36GB at 9.6Gbps, sold to GPU and AI accelerator makers for AI server packages.
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PEB000 Series Hardware
PCIe Gen5 enterprise SSD series in E1.S form factor with in-house ASIC and V8 4D NAND, power-optimised for AI servers and NVIDIA RVL-qualified for GB200 -- one model shipping today, PEB110 (1,920-7,680GB, 20W, mass production).
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PS1000 Series Hardware
PCIe Gen5 enterprise SSD series with in-house ASIC and V7 4D NAND for high-performance datacenter workloads, supporting up to 16TB in U.2/3 and the newer E3.S form factor -- two models shipping today, PS1010 and PS1030.
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SOCAMM2 Hardware
192GB LPDDR5X-based low-power memory module built on the 1cnm process and designed as main memory for AI servers, delivering over double the bandwidth of conventional RDIMM at over 75% better power efficiency.
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