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DDR5 RDIMM and MRDIMM

Hardware

by SK Hynix

DDR5 server memory modules: RDIMM up to 256GB at 4800-6400Mbps and higher, and MRDIMM at 32-128GB up to 8800Mbps, shown in SK hynix's AI DRAM lineup.

Find alternatives to DDR5 RDIMM and MRDIMM

What it does

• Memory

Used for

• AI compute hardware

Sources

Pricing

Not found · 23 Oct 2026

No price on the catalogue page; Contact Us in the footer.

Description

Official documentation · 23 Oct 2026

RDIMM "16-256GB Module Density, 4800-6400Mbps and higher"; MRDIMM "32-128GB, up to 8800Mbps"; "enabling simultaneous operation of two ranks, which increases bandwidth".

What it does

Official documentation · 23 Oct 2026

DRAM modules for servers.

Used for

Press release · 23 Oct 2026

"AI DRAM" zone of the DTF 2026 exhibit featured "3DS RDIMM, RDIMM" among key AI memory products; the catalogue page itself names no AI use.

Sold within

Not found · 23 Oct 2026

No purchase route beyond the site-wide Contact Us.

Name

Official documentation · 23 Oct 2026

Catalogue rows "RDIMM" and "MRDIMM", DDR5, Application: Server.

URL

Official documentation · 23 Oct 2026

SK hynix product catalogue, DRAM > Module.

Deployment

Official documentation · 23 Oct 2026

Server DIMMs installed in the customer's server.

Also from SK Hynix

• CMM-DDR5 Hardware

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• HBM3E Hardware

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• HBM4 Hardware

  Fifth-generation high-bandwidth memory with 2,048 I/O terminals and over 10Gbps operating speed, roughly doubling HBM3E bandwidth for next-generation AI accelerators.

• PEB000 Series Hardware

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• PS1000 Series Hardware

  PCIe Gen5 enterprise SSD series with in-house ASIC and V7 4D NAND for high-performance datacenter workloads, supporting up to 16TB in U.2/3 and the newer E3.S form factor -- two models shipping today, PS1010 and PS1030.

• SOCAMM2 Hardware

  192GB LPDDR5X-based low-power memory module built on the 1cnm process and designed as main memory for AI servers, delivering over double the bandwidth of conventional RDIMM at over 75% better power efficiency.

• HBM4E Hardware

  Next high-bandwidth memory generation after HBM4 (12-layer 48GB shown), for AI accelerators; sample shipments completed in the first half of 2026, not yet in mass production.

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