SOCAMM2
192GB LPDDR5X-based low-power memory module built on the 1cnm process and designed as main memory for AI servers, delivering over double the bandwidth of conventional RDIMM at over 75% better power efficiency.
No public price list; supplied to cloud service providers under contract. Same sitemap evidence as HBM3E.
What it does
- Memory
- AI compute hardware
- Model training
- Model inference
Sources
- Pricing
- Sold within
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SK hynix describes SOCAMM2 as its "perfect solution for AI Server" memory module; the page states no price and no purchase route beyond "Do you have some questions? Please Contact US."
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Official documentation · 1 Sep 2026
Catalogue page confirmed live 2026-09-01. Page title "SOCAMM2" matches the record name. Replaces the interim news.skhynix.com mass-production announcement kept since batch 2.
Also from SK Hynix
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CMM-DDR5 Hardware
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HBM3E Hardware
Fourth-generation high-bandwidth memory that vertically stacks up to 12 DRAM layers for 36GB at 9.6Gbps, sold to GPU and AI accelerator makers for AI server packages.
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HBM4 Hardware
Fifth-generation high-bandwidth memory with 2,048 I/O terminals and over 10Gbps operating speed, roughly doubling HBM3E bandwidth for next-generation AI accelerators.
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PEB000 Series Hardware
PCIe Gen5 enterprise SSD series in E1.S form factor with in-house ASIC and V8 4D NAND, power-optimised for AI servers and NVIDIA RVL-qualified for GB200 -- one model shipping today, PEB110 (1,920-7,680GB, 20W, mass production).
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PS1000 Series Hardware
PCIe Gen5 enterprise SSD series with in-house ASIC and V7 4D NAND for high-performance datacenter workloads, supporting up to 16TB in U.2/3 and the newer E3.S form factor -- two models shipping today, PS1010 and PS1030.
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